General Product Information:
NameHigh temperature resistant adhesive for Diode（THO4061）OutlineBeing temperature resistant, this one-component strain modified epoxy adhesive cures fast at room temperature, these qualities, added by the nature of being malleable, and low linear expansion coefficient make it easy to use.ApplicationsIt is applicable to the bonding, filling, sealing, plugging and restoration of light-emitting diodes under high temperature, as well as high-temperature reflow process. Features: it is white or transparent thick liquid, having no solid particles. Fast curing velocity. At 100℃, 120℃, 130℃, 140℃, it reaches its maximum bonding strength after 60, 30,20,10 minutes respectivelyBeing durable and resistant to ultraviolet light, once the bond has formed.Being heat-resistant, it adapts to a wide range of temperature and bonds well under high temperature. Mix the two components in a certain proportion, apply it to the surface of the substrates acquiring no strict treatment, which makes it so convenient to use. You'll see long term durability and resistance to moisture, chemicals, oils, and temperature extremes.Non-toxic after solidification, though it is a little smelly.Being stable, its storage time is 6 months.The main technical performance indicators are as follows:Heat resistance scope：-45－380℃Cementation intensity: Normal temperature: Tensile strength≥22MPa; Shearing strength≥23 MPa150℃: Tensile strength 3－5 MPaInstruction1. Clean the surface of the material, make sure they have no dust or oil on them, wait until they are dry.2. Spread the mixture on the substrates, put them together and apply some strength on them, heated it and let it dryNotes1. Better to keep the working place well ventilated.2 .If it has contact with skin, you should wash with soapy water.4. It can be stored at well-ventilated places with low temperature, and keep them away from fire. Cover the lip after using it.
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